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Vollflächige 3D-Deflektometrie für große Waferoberflächen

Full-field 3D deflectometry for large wafer surfaces

The new reflectCONTROL RCS3500-300 captures the entire surface of wafers with diameters of up to 300 mm in a single acquisition. Full-field 3D deflectometry enables precise measurement of wafer warpage, bow and local deformations, with short…

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Maximaler Messbereich trifft kompakte Bauform

Maximum measuring range meets robust design

The new MultiROI (Multi Region of Interest) function of the optoCONTROL 2700 enables up to 8 individual measuring zones within one measuring range to be monitored and evaluated separately. For example, in wire and filament break monitoring, the…

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Bis zu 8 Messzonen mit einem Sensor überwachen

Monitor up to 8 measuring zones with one sensor

The new MultiROI (Multi Region of Interest) function of the optoCONTROL 2700 enables up to 8 individual measuring zones within one measuring range to be monitored and evaluated separately. For example, in wire and filament break monitoring, the…

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3D-Messtechnik der nächsten Generation

Next-generation 3D measurement technology

The new confocalLINE CLI8500 combines the advantages of confocal sensors with intelligent 3D scanning technology. High precision, high dynamics and SMART 3D evaluation directly in the sensor: the confocalLINE sensors set new standards in industrial…

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