Monitoring the axial movement of internal hole saws
Internal hole saws are used for cutting silicon ingots. In order to achieve reliable separation of the ingot, the saw blade or holder is monitored using eddy current sensors. Four sensors measure the distance to the support of the saw without contact. Thanks to the high frequency response and the insensitivity to dust and dirt, the sensors provide reliable measurement values of the axial deviation of the saw blade. This ensures a homogeneous and even cut of the silicon wafers.