Glue bead measurement in dispensing systems

After the reflow soldering process, glue is applied on some points to protect the circuit. The glue bead thickness is a critical factor that is reliably inspected using laser sensors.
After the reflow soldering process, glue is applied on some points to protect the circuit. The glue bead thickness is a critical factor that is reliably inspected using laser sensors.
Micro-Epsilon Messtechnik
Königbacher Str. 15
94496 Ortenburg, Germany
info@micro-epsilon.com
+49 8542 / 168 - 0
+49 8542 / 168 - 90