Wafer thickness measurement / TTV

Confocal chromatic sensors measure the thickness deviation (Total Thickness Variation) and the wafer thickness from both sides. Based on the wafer thickness profile, bow and warp of the wafer can be detected. High measuring rates enable thickness detection of the entire wafer in short cycle times.

HEADQUARTER MICRO-EPSILON AMERICA
8120 Brownleigh Dr.
Raleigh, NC 27617
me-usa@micro-epsilon.com
919 787 9707
919 787 9706