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Highly precise distance sensors for the semiconductor industry


Measurement technology with sub-nanometer precision

Optimized for OEM series applications

For semiconductor engineering, optics and FAB automation

Highly precise displacement sensors for OEM series applications in semiconductor engineering

Sensor technology by Micro-Epsilon has been used successfully in the semiconductor industry for many years, with the right solution for any measurement task: We offer ultra-precise sensors for complex front-end processes, back-end applications and wafer handling automation. Our sensor solutions stand out thanks to their high accuracy, reliability, and long-term stability – even under challenging process conditions in the various manufacturing environments.

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Why Micro-Epsilon?

  1. More precision down to the picometer – Made in Germany
  2. Consulting, development & production from a single source
  3. Together with our customers: quality and problem-solving expertise in series & OEM
  4. In-depth technology and application knowledge in the field of semiconductor production
  5. Modern manufacturing methods for highly precise displacement sensors and sensor systems
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Superior sensor technologies for the semiconductor industry

For OEM series applications, we develop sensor products tailored to your specific requirements, with eddy current sensors and capacitive displacement sensors that deliver exceptional performance in challenging environments.
Kapazitive Sensoren für Halbleiterindustrie

Capacitive displacement sensors

Subnanometer-precise displacement measurement
Vacuum-compatible up to UHV
Adaptable to customer requirements
Extremely temperature-stable
Insensitive to radiation

Wirbelstromsensoren für Halbleiterindustrie

Eddy current displacement sensors

Nanometer-precise displacement measurement
Vacuum-compatible up to UHV
Adaptable to customer requirements
Extremely robust
Insensitive to magnetic fields

Optimized sensors for OEM series applications

For series applications, we modify our sensors according to your specifications, e.g. changes to the cable, sensor material and design as well as to the controller. In addition, application-specific sensor materials are also used.

Typical sensor specs for series applications:

  • Vacuum-compatible: low-outgassing materials and UHV-compliant manufacturing technologies
  • Special connection technologies
  • Labeling and packaging in compliance with semiconductor industry standards
  • Performance optimization for exceptional measurement accuracy
  • Maximum resistance to electromagnetic fields
  • High quality assurance standards across all process steps

Ready for Semicon – optimized production methods

All sensors and systems undergo complex manufacturing and testing procedures. This relates, among other things, to the selection and placement of the electronics, the mechanical manufacturing procedure and special process technology. 

Highly specialized manufacturing methods

  • USP laser technology
  • High-temperature vacuum brazing
  • Mechanical precision manufacturing
  • Burn-in tests
  • Fully automated potting lines
  • Passivation and coating of components and switch groups
  • Specialized cleaning processes
Diverse sensors for the semiconductor industry

Embedded coil technology

For particularly demanding OEM projects, we recommend embedded coil technology or embedded capacitor technology (ECT). Thanks to the miniaturized sensor design in inorganic material, almost all degrees of freedom are possible for the outer shape. And due to the ceramic substrate, the sensors are mechanically robust and extremely stable. If necessary, the entire evaluation electronics can be integrated in the sensor. This makes it possible to adapt ECT sensors to special installation situations. The ECT sensors are suitable for the harshest of use conditions and have proven their worth in numerous applications.

More precision for the semiconductor industry

Micro-Epsilon offers the right solution for diverse applications in the semiconductor industry – from high-precision optics positioning and stage alignment to hybrid bonding. The sensors are used in both front-end and back-end processes and stand out thanks to their supreme precision and reliability.

Wafer stage positioning
Highly precise wafer stage positioning
Wafer tilt monitoring
Wafer tilt monitoring
Wafer surface planarity
Wafer surface planarity testing
Alignment of optical systems
Precise alignment of optical systems

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