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Electronics production

In the electronics industry, increasing miniaturization and high production speeds are accompanied by highest quality standards. Sensors from Micro-Epsilon are used in high-tech production machines and production facilities and ensure that the high quality and requirements in terms of quality and efficiency are met. Thanks to the variety of models and the high precision of non-contact displacement sensors, Micro-Epsilon is a partner in almost all areas of the electronics industry - from chip production to complex assembly monitoring in the production of computers, smartphones and tablets.

3D inspection of unpopulated printed circuit boards

Conventional inspection systems such as measuring microscopes are not suitable as an automated inline solution because the inspection process takes a long time and these microscopes are very expensive. Therefore, 3D sensors from Micro-Epsilon are…

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3D Inspection of unpopulated PCBs

Distance measurement in dispensers for adhesives

In order to keep the adhesive dispenser always at the correct working distance, this distance value must be inspected continuously. For this purpose, compact laser sensors from Micro-Epsilon are used. Thanks to the fast measuring rate and the…

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Distance measurement in dispensers for adhesives

Presence monitoring of electronic components

Laser triangulation sensors are used in fully automatic presence inspection of components on printed circuit boards. Very small details can be detected reliably due to the small light spot. The high measuring rate enables testing in the shortest…

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Presence monitoring of electronic components

Dimensional inspection of fine mechanical structures

In assembly processes of smartphones and tablets, the dimensions and the assembly gap of the gasket are inspected in order to ensure high resistance to water and dust. Measurements are performed with Micro-Epsilon laser profile sensors that…

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Dimensional inspection of fine mechanical structures

Print head positioning in laser transfer printers

With printing and exposure processes, the exact height of the print head or the distance from the object to be printed are crucial factors for the quality of the final product. Fast distance measurements with compact laser sensors from…

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Print head positioning in laser transfer printers

Color recognition in component sorting tasks

Particularly with automated mounting, components must be sorted according to their color. The colorSENSOR CFO is ideally suited for these high production speeds. Adjustable colors and tolerance enable high flexibility. …

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Color recognition in component sorting tasks

Measuring the height of pressed-in pins (Press-Fit Technology)

In addition to high accuracy with miniature dimensions, the production of electronic components also requires high speed processes that provide the highest quality. Therefore, many production steps in this area are highly automated. The company…

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Measuring the height of pressed-in pins

Height measurement of wafer bumps

Up to now, the 50 to 350 µm small bumps are normally inspected by camera systems during production. The decisive disadvantage of this method is that only the presence or position is checked. The height can only be determined offline, by means of…

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Height measurement of wafer bumps

Measuring the coplanarity of IC pins

In SMT and reflow soldering processes, the coplanarity of the pins has to be inspected in order to assure a perfect soldering quality and to avoid failures. For this purpose, laser profile sensors from Micro-Epsilon are used. The scanner uses a…

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Measuring the coplanarity of IC pins

Thickness measurement of varnish on PCBs

In order to protect PCBs from environmental influences such as humidity, they are coated with a protective clear varnish. This ensures error-free operation. The automotive industry in particular demands a minimum thickness for this protective…

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Thickness measurement of varnish on PCBs

LED testing of electronic assemblies during the in-circuit test

colorCONTROL MFA LED test systems are used, among other things, in the electronics industry when quality control of printed circuit boards is performed by in-circuit testing (ICT) in the clean room. The correct functioning of electronic…

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LED testing of electronic assemblies during the in-circuit test

Measuring scribe lines on PCB panels

Scribe lines are pressed into printed circuit boards for separation purposes. Laser sensors inspect the line depth which should be consistent in order to ensure reliable separation.

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Measuring scribe lines on PCB panels

Heat conducting paste application

During the fully automatic application of heat conducting pastes, the correct dosage is a decisive factor. An overdosage of heat conducting paste impairs the thermal resistance, too little paste leads to thermal overload. The height of the paste…

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Heat conducting paste application

Measuring the solder-wave height on wave soldering machines

When soldering printed circuit boards in wave soldering systems, the height of the solder wave is an important criterion for the quality of the solder joints. The level of the soldering tin is detected directly above the solder wave using an…

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Solder wave height measurement in wave soldering systems

Presence detection of extremely small parts in electronics production

In electronics production, tiny parts that are barely visible to the eye are used. SMD resistors and miniature electronic components are used in large quantities on circuit boards. The optoCONTROL CLS1000 fiber optic sensor is used to…

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Presence monitoring small parts with fiber optic sensor