Recognition and measurement of bumps on silicon wafers

Confocal chromatic displacement sensors from Micro-Epsilon are used to inspect bumps. They generate a small light spot onto the wafer, while reliably detecting the smallest of parts and structures at high resolutions. Therefore, shape and dimensions of bumps are reliably measured for contacting purposes.

HEADQUARTER MICRO-EPSILON AMERICA
8120 Brownleigh Dr.
Raleigh, NC 27617
me-usa@micro-epsilon.com
919 787 9707
919 787 9706