3D inspection of unpopulated printed circuit boards
Conventional inspection systems such as measuring microscopes are not suitable as an automated inline solution because the inspection process takes a long time and these microscopes are very expensive. Therefore, 3D sensors from Micro-Epsilon are used to enable fully automated inline inspection of the substrates.
The high-precision 3D snapshot sensor surfaceCONTROL 3D 3510 measures directly in the production line on the matt surface of the substrates. The working distance is 120 to 140 mm. The recorded measurement values are calculated in the sensor and output to an external PC via the integrated Gigabit Ethernet interface. Further processing, evaluation and logging of the 3D data is possible with the powerful 3DInspect software.